Development products *One-stop support from wafer process to implementation
We will respond to your requests from the development stage to mass production.
★Joining of Dissimilar Materials By using metal as an adhesive, dissimilar materials can be firmly bonded through stable melting. Processing under high temperature and high vacuum achieves uniform metal melting. Using metal provides high chemical resistance, making it suitable for bonding medical devices. By utilizing plating, the bonding area can be specified, achieving high bonding precision. ★Anchor plate The anchor effect holds the specimen in an optimal shape at the desired position. ★Precision Jigs and Precision Molds These are high-precision tools utilizing semiconductor MEMS technology. Additionally, we offer a range of developed products such as liquid particle counters and MEMS products. If you would like detailed materials, please request them.
- Company：シチズンファインデバイス
- Price：Other
